发明名称 Thermal backfill composition method
摘要 A thermally conductive composition comprises an essentially homogeneous mixture of sand or sand-like particulate material with a binder, wherein the binder comprises an organic adhesive having an inorganic fine particle filler therein. The binder is present in at least an amount sufficient to begin to form a binder meniscus between adjacent sand particles, while the filler is present in the binder in an amount which significantly increases the effective thermal conductivity of the composition as compared to the same composition without filler.
申请公布号 US4361661(A) 申请公布日期 1982.11.30
申请号 US19800152254 申请日期 1980.05.22
申请人 WESTERN ELECTRIC COMPANY, INCORPORATED 发明人 JACKSON, KENNETH W.
分类号 B22C1/22;C04B26/02;C08K3/34;(IPC1-7):C08L63/00;C08L67/00;C08L71/00 主分类号 B22C1/22
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