A wire bonding machine for wedge bonding fine wires to semiconductor devices is provided with a rotating bonding head which is mounted on a fixed machine frame and having a X-Y table mounted on the fixed machine frame opposite a vertically movable bonding tool mounted on the rotating bonding head. The bonding head is provided with means for articulating the bonding tool in a vertical direction and in a rotational direction. The rotational movement of the novel bonding head does not impart vertical movement to the bonding tool.
申请公布号
US4361261(A)
申请公布日期
1982.11.30
申请号
US19800178368
申请日期
1980.08.15
申请人
KULICKE & SOFFA INDUSTRIES, INC.
发明人
ELLES, RICHARD J.;KULICKE, JR., FREDERICK W.;SADE, MOSHE E.;SOFFA, ALBERT