发明名称 WIRING AND HOT WATER HEATING STRUCTURE FOR FLOOR
摘要 PROBLEM TO BE SOLVED: To provide a floor wiring and hot water heating structure capable of guaranteeing both thermal efficiency for floor heating and the safe current carrying of a power cable, and allowing an easy work in the case of disposing a hot water pipe for heating and the power cable under a floor. SOLUTION: Support-fitted panels 1 having supports 11 erected thereon both longitudinally and horizontally at the prescribed intervals, are laid side by side on a floor foundation 30, and a cable (b) is laid via space between the supports 11 and 11 of the panels 1 so laid, and then heat insulation panels 2 having cylindrical parts 21 to be inserted in the supports 11 along the vertical direction of an intermediate plate 22 are mounted on the support-fitted panels 1 and so forth. In addition, a hot water pipe (a) is laid via space between the cylindrical parts 21 and 21 of the heat insulation panels 2, and then cover panels 31 and so forth are laid side by side on the laid support-fitted panels 1.
申请公布号 JPH10339023(A) 申请公布日期 1998.12.22
申请号 JP19970163432 申请日期 1997.06.05
申请人 NITTO DENKO CORP 发明人 MAMIYA NOBUO;NISHIMURA TAKAMASA;OYA YOSHIYUKI
分类号 E04F15/18;F24D3/16;H02G3/30 主分类号 E04F15/18
代理机构 代理人
主权项
地址
您可能感兴趣的专利