| 摘要 |
<p>PURPOSE:To prevent the damage of a semicondcutor device by surrounding an inner lead bent to have an elasticity with a stress buffering sleeve, thereby alleviating the contraction force applied to the lead. CONSTITUTION:An inner lead 3 is bent to have an elasticity, and a sleeve 9 of Si rubber tube is covered. The inner diameter of the sleeve is selected, and a space capable of absorbing Si resin 6 is formed by the surface tension between the lead 3 and the sleeve. According to this structure, the horizontal component of the resin contracting force applied to the lead 3 at the time of curing epoxy resin 1 and horizontal component of the mechanical shrinking force between a terminal board 2 and the lead 3 due to the thermal expansion coefficient difference between the lead 3 and the resin 1 are absorbed by the sleeve 9, and the vertical component of the resin contracting force and the mechanical shrinking force are absorbed by the lead having the elasticity. Accordingly, the damage of the soldered part of the lead is not produced.</p> |
