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发明名称
PACKAGE FOR ELECTRONIC COMPONENT
摘要
申请公布号
JPH11102998(A)
申请公布日期
1999.04.13
申请号
JP19970282769
申请日期
1997.09.29
申请人
NAKAMURA SEISAKUSHO KK
发明人
MIYAHARA HIDEYUKI
分类号
H01L23/28;H01L23/12;(IPC1-7):H01L23/28
主分类号
H01L23/28
代理机构
代理人
主权项
地址
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