发明名称 ALUMINUM HEAT SINK FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To obtain an aluminum heat sink having small size and high performance by casting part of plate-shaped fins of prescribed thickness and shape in a base. CONSTITUTION:Aluminum fins 2a formed in advance in the prescribed thickness and shape are aligned at the prescribed interval in parallel with each other, the edges of the same side are cast, and an aluminum base 2b of the prescribed outer diameter is integrally formed. When it is cast under pressure, no cavity is formed in the base 2b. A vacuum casting may be adopted. According to this structure, a fin base can be integrally formed similarly to the heat sink by an extruding die material or a casting, and when casting conditions are determined, an elevated technique is not necessary, and the manufacture can be simply facilitated. The shape and the thickness of the base can be arbitrarily formed, thin fins can be formed in high density, thereby enabling small size and high performance. When a copper plate is cast to a semiconductor element mounting surface 2b or a terminal mounting part at the time of casting under pressure, a preferable heat sink can be obtained with inexpensive cost.
申请公布号 JPS57193049(A) 申请公布日期 1982.11.27
申请号 JP19810077355 申请日期 1981.05.23
申请人 KOBE SEIKOSHO KK 发明人 ODA MAYUMI;KOUNO NORIHIKO;OZAKI KOUICHI;KOIKE SUSUMU
分类号 H01L23/36;H01L23/367 主分类号 H01L23/36
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