发明名称 BONDING METHOD AND DEVICE FOR SMALL PIECE TO WORKPIECE
摘要 PURPOSE:To improve the working efficiency of bonding a small piece to a cylindrical workpiece by sequentially bonding the piece to the groove of the workpiece when the piece is bonded to the periphery of the workpiece, and then rotating the workpiece while supporting the workpiece by a belt, thereby eliminating the interruption of bonding work for waiting for the drying of an adhesive. CONSTITUTION:A small piece is bonded to the groove 1' of a workpiece 1. The workpiece 1 is immediately rotated without waiting for the drying of an adhesive, and the piece 2 is rigidly fixed to the workpiece 1 by the tension of a belt 8. Then, the piece 2 is bonded to the remaining groove 1', a lever 18 is pressed down after all the pieces 2 are completely bonded to the workpiece 1, and the workpiece 1 is removed from a supporting base 11 in the state that the rollers 3, 4 are moved toward the positions 3', 4' of the rollers. The adhesive is sufficiently dried at the other place, and the piece 2 is completely bonded to the workpiece.
申请公布号 JPS57193314(A) 申请公布日期 1982.11.27
申请号 JP19810078130 申请日期 1981.05.25
申请人 HITACHI KINZOKU KK 发明人 KURODA MASANOBU;KOBAYASHI SHINICHI
分类号 B29C55/00;B29C65/00;B29C65/48;F16B11/00 主分类号 B29C55/00
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