| 摘要 |
A resin-molded electronic circuit device is provided with a protection resin molded with covering electronic components and an electronic circuit substrate and having almost the same coefficient of thermal expansion as that of a metal forming the electronic components and the electronic circuit substrate, and a connector mounted at an end of the protection resin and functioning as an external connecting terminal of the electronic circuit substrate. Since a case for housing the protection resin is unnecessary, it is possible to decrease the number of components and man-hours, and enhance the outside appearance of the electronic circuit device.
|
