| 摘要 |
PURPOSE:To improve the heat radiation, by performing the heat radiation of the leadless package through a heat radiating fins on the back surface, and providing a window for exhausting the gas generated in brazing the heat radiating fins at a connecting conductor part of the heat radiating fins. CONSTITUTION:A semiconductor chip 6 is mounted on the leadless package 2. The semiconductor chip 6 and the leadless package 2 are connected by an electric conductive wire 7. The semiconductor chip 6 is sealed by a cap 3. At the connecting conductor part of the heat radiating fins 1, the window 9 for exhausting the gas is provided. As a result, the void yielding rate at a brazing part 8 of the connecting conductor part of the heat radiating fins becomes low, and the heat radiating effect can be remarkably enhanced by the improvement in conduction effect. |
