| 摘要 |
PURPOSE:To apply the paste flatly onto a substrate, and to mount a semiconductor pellet simply and positively onto the substrate by supplying the paste onto the flat surface of a pad for application and pushing the surface coated with the paste of the pad against the necessary position of the substrate. CONSTITUTION:When the silver paste 6 is mounted onto the tub 2 of a lead frame, the paste 6 is first discharged onto the flat end surface of a square- shaped rubber 12 once from the nozzle 9 of a dispenser 8. The square-shaped rubber 12 is rotated in a 180-degree arc, and the paste and the end surface to be coated are pushed onto the tub 2 by means of a vertical moving mechanism. consequently, the paste 6 is flatly applied onto the tub 2 from the square-shaped rubber 12. Accordingly, since the paste 6 is also left in the square-shaped rubber 12, push thereof is completed, though the quantity is extremely slight, ineffectual application is not brought even when bubbles mix into a cylinder 7 and the paste 6 is not discharged, and application is enabled again. |
