| 摘要 |
PURPOSE:To make it possible to align the direction by a parts feeder automatically and to supply the semiconductor devices automatically by arranging leads irregularly. CONSTITUTION:Every 5 leads 3 are protruded from the front and rear sides of a package 2 at an equal pitch (a). The second lead at the rear surface is cut short in the vicinity of the outer surface of the package 2 so as to form a dummy lead 6, whose tip does not contact with insertion holes and a land of a printed board. The third lead at the front surface of the package 2 is also the dummy lead. Since the lead arrangement is asymmetrical and irregular, the direction is automatically aligned by the parts feeder, and the devices can be supplied to various equipment. |
