| 摘要 |
<p>PURPOSE:To reduce the mechanical strain which is applied to a semiconductor element or an insulating substrate, by providing grooves or slits in a heat radiating substrate, and absorbing the returning deformation of warping due to screw tightening at these parts. CONSTITUTION:One or more grooves 11 or slits are provided at the part between the screw holes for fixing a heat radiating plate of the heat radiating copper substrate 1 to which insulating substrate 3 comprising alumina is soldered and on the surface on the side of the heat radiating plate. When the insulating substrate 3 is bonded to said heat radiating substrate 1 with solder 2, the warp is generated by the bimetal effect caused by the difference between the linear expansion coefficient of the heat radiating substrate 1 and that of the insulating substrate 3. When the semiconductor device is fixed on the flat heat radiating plate 9 under this state, the groove parts 11 or the slit parts absorb the deformation due to the screw tightening, the strain applied to the insulating substrate 3 or the semiconductor element 5 is alleviated, and the destruction can be prevented.</p> |
