| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a wiring pattern for easily and quickly forming a wiring pattern in a coil and the other arbitrary shape, and for quickly facilitating a countermeasure to the change of design. SOLUTION: This method includes a metallic thin film forming process #101 for forming a thermally destructive and conductive metallic thin film layer 12 on an insulating sheet 11, and a pattern forming process #102 for thermally destroying the metallic thin film layer 12 formed in the metallic thin film forming process #101 by a thermally sensitive head 41 according to a wiring pattern 13 to be obtained. Thus, it is possible to quickly facilitate a countermeasure to the plural kinds of wiring patterns whose chip variety or communication distance specification is different. Also, it is possible to further quickly prepare a wiring pattern by preliminarily forming a general wiring pattern equipped with a short-circuit part, and thermally destroying the short-circuit part when the wiring pattern is decided. |
