| 摘要 |
PURPOSE:To miniaturize a cavity in solder with micro size for good adhesion by a method wherein solder is fused on adhesion scheduled region, and a semiconductor element is subject to press-swing with the application of supersonic vibration via fused solder layer. CONSTITUTION:An element 3 adsorbed to the semiconductor element support surface 2 of a collet 11 with the descent of a supersonic vibration transmitting rod 13 to be contacted on the element 3. Next, press, swing and supersonic vibration are applied to the fused solder 5 on the element adhesion scheduled region of a stem 4. In this method, the solder 5 is subject to pressure and release at very high frequency. Besides, a cavity produced on the adhesion surface by the action of forces from the center to the outer boundary is gradually dispersed to a small size with a part thereof dissipated outward of the element 3. Thus, the cavity left in the solder layer is reduced to an extremely micro size in a small amount for the control of thermal resistance with long life time of the device. |
