| 摘要 |
PURPOSE:To prevent the destruction of connection and the falling of parts due to oscillation, etc., by securing the connection between the parts and a lead frame by embedding the parts connected to the lead frame in an outer mold in one body. CONSTITUTION:An LSI12 is stuck to a lead frame 11 and sealed by inner molding 13. Then, the lead surface of the lead frame 11 is plated with nickel, etc., and a soldering material is applied; and parts 14 such as a chip capacitor are stuck and connected to the surface by baking. Said part 14 are sealed by outer molding 15 together with the lead frame 11. In openings at the center part and circumferential part of the outer mold 15, an LCD18, a quartz oscillator 19, etc., are arranged and connected. |
