| 摘要 |
PURPOSE:To make possible more accurate compensation of temperature characteristics by a construction wherein a diode wafer for temperature compensation is incorporated in one and the same package and mounted on the same base. CONSTITUTION:An avalanche photodiode wafer 1 and a diode wafer 2 for the compensation of temperature characteristics are mounted on one and the same base 3, and a can case 4 is provided in such a manner that it encloses these wafers 1, 2. A lead 5 is led out of the can through the base 3. By packaging the avalanche photodiode wafer 1 and the diode wafer 2 for the compensation of temperature characteristics on the same base, both of them are placed under the same temperature conditions and, even if their temperature coefficients are different, the accurate compensation of temperature characteristics can be achieved by the diode wafer 2. |
