发明名称 HEAT TREATING DEVICE FOR BAND STEEL PLATE
摘要 PURPOSE:To obtain a band steel plate heat treating device which has uniform thermal conductivity in the width direction having a small pressure drop of high-speed gas in cooling or heating a band steel plate continuously, by arranging nozzles, each consisting of a curved surface with adequate curvature as an inflow part and a tapered pipe and having an inwardly rounded tip, in the front surface wall of a plenum chamber. CONSTITUTION:To constitute a device which cools or heats a band steel plate 4 continuously, nozzles each consisting of a curved surface 9 with adequate curvature as an inflow part and a tipe pipe 10 succeeding to it and having an inwardly rounded tip 11 are arranged in the front surface wall 7 of a plenum chamber at adequate intervals. Then, cooling (heating) gas flowing into the slit nozzles 3 is flowed firstly along the curved surfaces 9 of nozzle entrance parts without being separated from nozzle internal surfaces, reduced in area by choke tubes 10, and blown out without causing any turbulence by the roundness of the tips 11. Then, this blown gas, after striking a plate 4, is flown in the width direction of the nozzles in the space formed of the plate 4, the center lines delta1 and delta2 of the nozzles, the external surfaces of the nozzles, and the front surface wall of the plenum chamber. As a result, uniform thermal conduction in the width direction of the band steel plate is obtained.
申请公布号 JPS57188624(A) 申请公布日期 1982.11.19
申请号 JP19810072177 申请日期 1981.05.15
申请人 MITSUBISHI JUKOGYO KK 发明人 YANAGI KENICHI;MIHARA KAZUMASA;MAKIHARA KATSUMI;FUKUSHIMA TAKEO
分类号 C21D1/00;C21D1/34;C21D9/56;C21D9/573 主分类号 C21D1/00
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