Automatic polishing machine for semiconductor wafers - has stack of cassettes carrying wafers with pistons to push cassettes into and out of polishing position

摘要

The automatic polishing machine includes a loading and unloading mechanism for cassettes which carry the thin plates. A support carries a stack of cassettes and may be moved vertically on a post. A cassette support includes two slide rails lying parallel in a horizontal direction to receive one cassette from the stack. Two pistons are provided on either side of the stack - one to push the cassette from the stack, into the polishing position, and one to return it to the stack. An arm which may be moved both vertically and horizontally is attached to a supporting mechanism. On the free end of the arm there is a cassette support and a polishing head (7). In use this is situated adjacent to the stack to receive a cassette of plates for polishing.