| 摘要 |
PURPOSE:To join the tin layer of the surface of a connecting electrode on the circuit element such as a light emitting diode for fixing the circuit element onto a wiring substrate through face-down bonding as a gold tin alloyed layer by preventing the oxidation of the tin layer by a gold film. CONSTITUTION:The cathode electrode 3 and anode electrode 4 of the circuit element 1 such as the light emitting diode are each formed by gold evaporated layers 15, tin evaporated layers 16 and gold protective films 17 preventing the oxidation of the tin evaporated layers. The oxidation of these each electrode is prevented by the gold protective layers, and gold tin eutectic alloys are formed through heating and bonding is easily conducted when face-down bonding. |
