发明名称 ADHESION OF WAFER
摘要 PURPOSE:To remove the strain due to wax which is generated on a wafer by press-attaching a wafer onto a carrier plate and turning the wafer by a prescribed angle. CONSTITUTION:In the rotary mechanism 4 of a twisting machine, an installation plate 41 is installed in free revolution onto the upper edge of a stay 40 erected on a tilt table 2 so as to be positioned and stop at each prescribed position. The installation plate 41 is formed by cutting three parts on a disc at equal intervals, and a twisting machine 5 is installed at the cut part. The twisting machine 5 is equipped with a cylinder 51 installed onto the installation plate 41 through a bracket 50. Further, a cylinder 61 is rotatably connected between one of a plurality of holes drilled on a twisting arm 59 and a cylinder receiving tool 60 fixed onto the upper surface of a base plate 54. A pressing rotary mechanism 62 is arranged from a driving gear 58 to the lower position, penetrating through the basic plate 54.
申请公布号 JPS6393538(A) 申请公布日期 1988.04.23
申请号 JP19860238793 申请日期 1986.10.07
申请人 MITSUBISHI METAL CORP;JAPAN SILICON CO LTD 发明人 SAEKI KAZUNORI;ISHII KEIICHI;KOYAMA KOJI
分类号 B23Q3/08;B24B37/04;B24B37/30;H01L21/68;H01L21/683 主分类号 B23Q3/08
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