发明名称 WAFER ATTACHING DEVICE
摘要 PURPOSE:To smoothly attach a wafer at a prescribed position on a carrier plate in the uniform direction of the wafers by installing a positioning device for turning the wafer and securing the uniform direction onto a transport means. CONSTITUTION:A turntable 3 is supported in free elevation for a cylinder 4 arranged under the table 3 and a guide mechanism 5, and is positioned at each 90 deg. and stops. Further, each wafer loading seat 2 has a plurality of circular stepped parts in concentric form so ass to correspond to a plurality of wafers W having different diameters. Further, a wafer positioning device 6 is arranged at the position deflecting by 90 deg. from a transport conveyor 1 of the turntable 3. The wafer positioning device 6 consists of a rotary plate 7 for loading and turning the wafer W and a sensor 8 for detecting the existence of the cut part on the wafer W.
申请公布号 JPS6393537(A) 申请公布日期 1988.04.23
申请号 JP19860238792 申请日期 1986.10.07
申请人 MITSUBISHI METAL CORP;JAPAN SILICON CO LTD 发明人 TSUTSUMI YUKIO;ISHII KEIICHI;SAEKI KAZUNORI;KOYAMA KOJI
分类号 B23Q3/08;B24B37/04;B24B37/30;H01L21/304 主分类号 B23Q3/08
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