| 摘要 |
PURPOSE:To judge automatically whether a pattern is good or not, by comparing a sampling pattern for checking with a remaining pattern in dimensions by image process. CONSTITUTION:A wafer 1 for checking is mounted on a mounting 9. An image pickup device 11 converts a pattern image of the wafer 1 surface magnified by a magnifying lens 10 into an electric image signal (e). The image signal (e) is digitalized at a binary circuit 12. An image processor 13 measures widths of a sampling pattern for checking and a remaining pattern according to the information, and compares in dimensions. The result judges wheter the wafer 1 for checking is good or not. Finally, an indicator 14 indicates the judgement result of good or not. |
