发明名称 APPLYING METHOD OF PHOTORESIST
摘要 PURPOSE:To prevent the surrounding part and side surface of a wafer from applying of photoresist, by covering the surrounding part of the wafer with a cover in case of applying with a shower or in spraying. CONSTITUTION:A nozzle to blow photoresist liquid, specially a positive type liquid to a wafer in showering or spraying is provided, and a wafer 31 which applies a resist is provided under the nozzle. Around the wafer 31, a cover 42 is fitted only to a surrounding part so that the resist is not applied on it. By this way, it is eliminated that the resist rises to become thicker around the wafer and the resist adheres to its side surface. Specially in case that a positive type resist is used, a light does not reach easily to the surrounding part and side surface of the wafer and the resist remains often there, therefore this way is effective.
申请公布号 JPS57186750(A) 申请公布日期 1982.11.17
申请号 JP19810071655 申请日期 1981.05.12
申请人 NIPPON DENKI KK 发明人 OKUYAMA YASUSHI
分类号 G03C1/74;B05D1/32;G03F7/16 主分类号 G03C1/74
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