Ceramic wiring boards.

摘要

A ceramic wiring board which comprises a ceramic part in which through-holes are made, a sintered wiring pattern part provided on the surface of the ceramic part and a sintered conductor part filled in the through-holes, shows a decrease in cracks at the through-hole part caused by sintering and reduction in moisture absorbency when the ceramic part comprises ceramic and a sintering assistant and the sintered conductor part comprises a metal and the same sintering assistant as that present in the ceramic part.