METHOD OF BONDING WIRES TO PASSIVATED CHIP MICROCIRCUIT CONDUCTORS

摘要

METHOD OF BONDING WIRES TO PASSIVATED CHIP MICROCIRCUIT CONDUCTORS A wire is positioned in intimate contact with a microcircuit hip above a conductor line or pad on the chip. The line is protected by a thin film layer of passivating or insulating material deposited upon the chip. A short pulse, focussed, energy source such as a laser beam drills a hole through or on the edge of the wire, and also opens a hole drawn through the insulating material to expose the conductor line. Then energy is directed upon the portion of the wire surrounding the hole to melt metal from the wire down into the hole which coalesces with molten metal below to form an electrical and mechanical bond of the wire to the line. YO978-042