| 摘要 |
Disclosed is a method and apparatus for processing printed circuit boards which do not have a plating buss or plating bar by means of continuously passing the printed circuit boards through a plating cell in which a cathode brush is employed to contact the leads above the tabs while the brush is shielded both above and below in a chamber defined by a pair of shields. Desirably the chamber is pressurized with a gas, normally air, to preclude the migration of solutions such as electroplating solution from the plating cell onto the brush which would become plated itself and lose its effectiveness if contacted by the electrolyte. The plating cell utilizes a sparger and reverse flow chamber and an anode, the anode being positioned essentially in the reverse flow chamber to accomplish the plating. The anode is electrically energized and the cathode is independently energized to provide the current necessary for the plating.
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