发明名称 SPUTTERING DEVICE
摘要 PURPOSE:To improve sputtering efficiency in a sputtering device by providing holders which are mounted with plates to be treated on both surfaces and are provided with shutters in a right angle direction, freely rotatably around a central cylindrical target. CONSTITUTION:Plural substrate holders 12 are disposed concentrically around a cylindrical target 11 in a vacuum vessel. Substrates 14 to be sputtered are mounted on both surfaces of each holder 12 and a shutter 13 is installed thereto in the direction at a right angle to the holder. The holders 12 are made rotatable around the center in directions (e), (f). During presputtering, the shutters 13 are directed to the target like dotted lines and during sputtering, the holders 12 are rotated to direct one of the substrates 14 toward the target 11 like solid lines, whereby the substrates are sputtered. Following to this, the holders are rotated 180 deg. and the substrates 14 on the opposite side are sputtered. The substrates are sputtered with high treatment efficiency by mounting two sheets of the substrates on the front and rear of one piece of the holder 12.
申请公布号 JPS57185974(A) 申请公布日期 1982.11.16
申请号 JP19810069150 申请日期 1981.05.07
申请人 MURATA SEISAKUSHO:KK 发明人 SENDA ATSUO;TANAKA KATSUHIKO
分类号 C23C14/34;B01J19/08;C23C14/50 主分类号 C23C14/34
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