| 摘要 |
PURPOSE:To facilitate assembly by decreasing the number of parts by using a normal metallic package for a semiconductor as a container. CONSTITUTION:As a container for a sensor, a metallic cap 11 used for a semiconductor element and a metallic package made of a metallic base plate (stem) 12 are used. The stem, 12 has an opening part 13 in the center and a cylindrical pedestal 14 is arranged therein. In the pedestal 14, a silicon pressure sensitive diaphragm 16 is fixed to fill the center through hole 15. The pedestal 14 is supported, on the opposite side to the diaphragm, by a cap 17 through a cylindrical base 18 made of a thin plate. |
