| 摘要 |
<p>PURPOSE:To display the performance of a semiconductor element sufficiently and to achieve the excellent function, high density, compact size and improvement in reliability of a power electronic device, by arranging and containing a plurality of thin semiconductor pellets on the same surface in a hollow conductive block, and providing the structure wherein the pellets are compressed from the outside at the same time. CONSTITUTION:A diode pellet 1 is arranged at the center, and a plurality of switching elements 2 are arranged at the periphery. The switching elements 2 are connected in parallel in the inside, and the large capacity is achieved as the elements. A flexible conductive spacer is inserted into the contact surface of each pellet 1, and the compressing force between the pellets 1 at the time of compression is equalized, Furthermore, only the contact surface of each pellet 1 is made thick so as to increase rigidity, and the other part is made thin so as to provide flexibility. The compressing force between the pellets at the time of compression is equalized in this structure. The switching elements 2 are arranged in the geometrically symmetrical pattern and connected at the shortest distance with a block part. Therefore, the current balance is excellent. The compression balance is excellent becuase of the compression with the block part.</p> |
