PROCEDE D'ETAMAGE D'UNE COUCHE CONDUCTRICE DISPOSEE SUR UN DIELECTRIQUE ET SON APPLICATION A UN CIRCUIT MULTICOUCHES POUR CIRCUIT HYBRIDE

摘要

Plating of conductive layer on dielectric comprises (a) plating by immersion; (b) screen printing of a solder paste on the regions plated by immersion; (c) placing the components on the plated zones; and (d) re-fusing the assembly. Pref. the plating by immersion takes place in an alloy contg. at least 2 of Sn, Pb and Ag, and the solder contains at least 2 of Sn, Pb and Ag. Pref. the re-fusion takes place at a temp. greater than 30 deg.C above the fusion temp. of the two alloys used during the first and second stages. Used in multilayer circuits for hybrid circuit applications. Process gives a strong connection between the conducting layer and the dielectric.