| 摘要 |
PURPOSE:To enable to mount an element using the tape automated bonding method wherein a solder layer is provided on a base metal thick film conductor formed on a substrate, and a thick film conductive material of base metal is used. CONSTITUTION:An alumina substrate 2 is thoroughly cleaned and degreased, a Cu conductor 5 is printed, and then heating and sintering processes are performed. Then, a solder layer 6 is formed on the conductor 5. On the ceramic solid-state substrate manufactured as above, an element 1 is mounted using the tape automated bonding (TAB) method. The substrate 2 is heated when the element 1 is usually mounted using the TAB method, but in this case, as a solder layer 6 exists on the conductor 5, no oxidation is performed on the conductor 5, and excellent bonding characeristics can be obtained. |
