发明名称 TERMINAL MOUNTING ON DOUBLE-SIDED CIRCUIT SUBSTRATE
摘要 PURPOSE:To prevent the coming off of one-sided terminals by a method wherein folded sections are cut after welding and hardening terminals consisting of a wire rod and folding up into the surface and reverse sides of terminals on a double-sided circuit substrate. CONSTITUTION:Terminals 3 consisting of a wire rod and folding up into the surface and reverse sides of terminals 2 on a double-sided circuit substrate 1 are mounted so that the terminals 3 may elastically be held on the terminals 2 and the folded sections of the terminals 3 are cut after soldering. In this way, the coming off of the one-sided terminals going with solder melting can be prevented.
申请公布号 JPS57181148(A) 申请公布日期 1982.11.08
申请号 JP19810066404 申请日期 1981.04.30
申请人 MATSUSHITA DENKO KK 发明人 IRIE TATSUHIKO
分类号 H01L23/50;H01L23/498 主分类号 H01L23/50
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