SINTERED ALUMINUM NITRIDE BODY WITH HIGH HEAT CONDUCTIVITY

摘要

PURPOSE:To provide high heat conductivity to a sintered aluminum nitride body suitable for use as the material of the insulating substrate of a large-scale integrated circuit, etc. by adding a beryllium component to aluminum nitride as the principal component. CONSTITUTION:To aluminum nitride powder is added >=1 kind of substance contg. beryllium such as beryllium or beryllium oxide so as to make the beryllium content about 0.05-10wt%. This mixed powder is press-molded and sintered to form a sintered body having density corresponding to >=90% of the the oretical density. This sintered aluminum nitride body has characteristics such as >=0.3cal/cm.s. deg.C heat conductivity at room temp., >=10<12>OMEGA.cm electric resistivity and <=6X10<-6>/ deg.C average coefft. of thermal expansion at room temp. -300 deg.C.