| 摘要 |
PURPOSE:To obtain a bonding pad which is highly reliable and is not damaged by moisture and so forth by a method wherein when a bonding pad is formed on an Si substrate via an insulation film, the pad is composed of a polycrystal Si film as a conductor and an Al electrode film formed on the Si film. CONSTITUTION:A conductive polycrystal film 6 which is to be on internal wiring is formed on an Si substrate 1 via an insulation oxide film 2. An aperture for contact is made in an insulation film 3 on the film 6 at the bonding pad part and an Al electrode film 7 which gets contact with the film 6 is formed so as to cover the edge of the film 3. Then the surface of the substrate other than the bonding pad part on the film 7 is covered by a passivation film 4. With this constitution, as the conductive polycrystal film 6 is used for drawing the wiring out of the pad, the drawing out part of the wiring is not damaged by moisture and impurity ion. Moreover high frequency response property is also improved. |
