发明名称 MOLDING METHOD FOR FILLER-CONTAINING LOW MOLECULAR WEIGHT THERMOPLASTIC RESIN COMPOSITION
摘要 <p>PURPOSE:To obtain a colored molded product having no discolored part by injecting once a dry blended mixture of a powder inorganic filler and a powder low molecular weight thermoplastic resin directly by a heat plasticizer through a cooled material supplying unit. CONSTITUTION:A powder blend 11 of 90-50wt% of powder inorganic filler such as clay and 10-50wt% of powder low molecular weight thermoplastic resin such as polyethylene having mean molecular weight of 200-3,000 or the like is supplied to an agitating hopper 1 of a material supplying unit A, and the blend is supplied each in the prescribed amount in numelted state to the material supply port 18 of a heat plasticizer B while cooling and agitating the blend with an inner screw 12. The supplied blend 11 is then melted by a heater 4 of the plasticizer B. The blend is kneaded and fed simultaneously from a compression section 6 of the screw 13 to a weighing section 7, and a completely homogenious melted mixture is produced in a heating cylindrical head 8. This mixture is injected into a mold 10.</p>
申请公布号 JPS57178732(A) 申请公布日期 1982.11.04
申请号 JP19810062768 申请日期 1981.04.25
申请人 NIPPON SEKIYU KK 发明人 KOBAYASHI SADAMU;AMANO OSAMU;IWAI SAKUYA
分类号 B29B7/00;B29C35/00;B29C45/00;B29C47/00;B29C47/10;B29C47/82;B29C47/92 主分类号 B29B7/00
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