| 摘要 |
The present invention provides a method for testing semiconductor wafers by means of a temperature-regulated chuck device, comprising the following steps: controlling the temperature of the chuck device to a predetermined measurement temperature by means of a heating device having a predefined heating power and a cooling device having a predefined cooling capacity, the heating power being substantially greater than a predefined testing power; laying the rear side of a semiconductor wafer on a supporting side of the temperature-regulated chuck device; placing a probe card on the front side of the semiconductor wafer; testing the semiconductor wafer by impressing the testing power from a testing apparatus into a chip region of the front side of the semiconductor wafer by means of probes of the probe card placed on; reducing the heating power by the amount of the testing power during the testing with a substantially constant cooling capacity. The invention also provides a corresponding apparatus.
|
