发明名称 |
HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE, SEMICONDUCTOR WAFER GRINDING METHOD USING SUCH SEMICONDUCTOR WAFER PROTECTING STRUCTURE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD |
摘要 |
<p>Provided are a holding jig which can eliminate troubles due to use of a protection sheet, a semiconductor wafer grinding method, a semiconductor wafer protecting structure, a semiconductor wafer grinding method using such semiconductor wafer protecting structure, and semiconductor chip manufacturing method. A holding jig (20) for holding a semiconductor wafer (W) is composed of a recessed hole (22) formed on the surface of a substrate (21); a plurality of supporting protrusions (23) arranged to protrude from the bottom surface of the recessed hole (22); a deformable adhesive film (24), which covers the recessed hole (22) by being supported by the supporting protrusions (23) and adhesively and removably holds the semiconductor wafer (W); and an exhaust path (25) for leading the air inside the recessed hole (22) covered with the adhesive film (24) to the external.</p> |
申请公布号 |
WO2007105611(A1) |
申请公布日期 |
2007.09.20 |
申请号 |
WO2007JP54628 |
申请日期 |
2007.03.09 |
申请人 |
SHIN-ETSU POLYMER CO., LTD.;LINTEC CORPORATION;TANAKA, KIYOFUMI;ODASHIMA, SATOSHI;HOSONO, NORIYOSHI;FUJIMOTO, YASUSHI;SEGAWA, TAKESHI |
发明人 |
TANAKA, KIYOFUMI;ODASHIMA, SATOSHI;HOSONO, NORIYOSHI;FUJIMOTO, YASUSHI;SEGAWA, TAKESHI |
分类号 |
H01L21/683;B24B37/04;B24B41/06;H01L21/304 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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