| 摘要 |
PURPOSE:To obtain a constant position or parallelness of the semiconductor element and a housing with high accuracy by a method wherein the semiconductor elemnt is sticked to a semiconductor element mounting region with polyimide resin and is adhered by heating at 350-400 deg.C. CONSTITUTION:Polyimide resin 10 which withstands the temperature higher than 500 deg.C is applied on a semiconductor element mounting region 14b and a semiconductor element 2 is put on the resin 10 by vacuum tweezers. Then the thermal treatment is performed at 100 deg.C for one hour, at 200 deg.C for one hour and at 350-400 deg.C for one hour successively and the resin 10 is hardened. With this constitution, the semiconductor element can be mounted at room temperature and the high ambient temperature is not necessary. |
