| 摘要 |
PURPOSE:To obtain a reliable junction of pellet and wire by a method wherein a well or a mesa is produced in a prescribed region on a substrate primary surface and a bonding agent is supplied with its surface level after application. CONSTITUTION:A lead frame with a well provided in the primary surface of its tab 1 is used. The well 6 is but little larger than a pellet 3. Silver paste 2 is applied into the well 6. The top surface of the silver paste 2 becomes flat thanks to the circumferential wall of the well 6 standing against the paste 2 and, accordingly, the pellet 3 can be fixed level. Even in the event of the silver paste 2 landing on a location a little different from the right spot, a portion of the paste 2 accepted by the well 6 sinks down and the top surface thereof becomes level, and the pellet 3 can establish area contact with the silver paste 2. The product is then subjected to firing, bonding is done prescribedly, and unnecessary parts are separated. The pellet 3 being bonded level to the lead frame of the tab 1 (substrate), the bonded region is uniformly pressurized at the time of wire bonding. Connection is sure and junction reliable, pellets are less easy to be broken and the quantity of usable products increases. |
