MAKEN VAN SPAANPLAAT EN DAARVOOR GESCHIKT BINDMIDDEL.

摘要

The invention concerns the manufacture of particle board having a very low formaldehyde emission, and a novel bonding agent. The essential feature is the use of a melamine-modified urea-formaldehyde adhesive with a ratio of formaldehyde to aminogroups of between 0.500 : 1 and 0.575 : 1, which contains melamine in an amount of between 1.0 and 10% by weight relative to resin solids. The boards which are so obtained have a very low formaldehyde emission (FESYP perforator value below 0.01%) and yet satisfactory physical properties.