| 摘要 |
PURPOSE:To obtain a conveying device which can convey a wafer directly to a processing machine by providing wafer pushing means, thereby positioning the wafer in the containing case from the state of the wafer in the horizontal case. CONSTITUTION:In a wafer conveying device in which a containing case 1 having holes at the top and containing a plurality of wafers aligned vertically is laid down to set the wafer 2 horizontal for absorbing and conveying the wafer 2 from the hole direction, a wire spring 7 (urging means) contacted with the side edge of the wafer before adsorption is provided at the rear side of the moving direction (in a direction of an arrow along a rod 6) for allowing the adsorption pad 5 to cause adsorption. When the pad 5 moves horizontally, the spring 7 contacts with the side edge of the wafer, and when the pad 5 subsequently move, the wafer 2 is positioned on the bottom of the case 1 (tapered part 1') to urge with slight elastic force. Thereafter, the wafer 2 is attracted and transferred by the pad 5, and is positioned accurately on a chuck 4. |
