| 摘要 |
PURPOSE:To enhance the reliability of detecting a bonding mistake by providing a circular section unit rotating in response to the movement of a wire, and light emitting element and photodetector for detecting the rotation of the unit, thereby detecting the bonding error with the output signal of the photodetector. CONSTITUTION:A wire bonding device is composed of an X-Y table 4, an electric torch 13, a hollow tool 2, a clamper 11, and a wire tension tool 12. A rotatable roller 6 (circular section unit) is provided to interpose a wire 1 at a suitable position between the tools 2 and 12, and is connected to a slit plate 7. A rotation detector having a light emitting element 8 and a photodetector 9 is mounted at the position faced opposingly via the plate 7. After the wire is bonded, the tool 2 is moved. Then, the wire 1 is moved, and the roller will rotate in response to the movement of the wire. This rotation is detected by the pulse output of the photodetector 9. When a bonding error occurs, wire 1 does not move, and no pulse output is produced. |
