| 摘要 |
PURPOSE:To prevent the improper connection caused by a thermal deformation by providing a spacer made of a conductor layer and a resin layer on a substrate to suitably restrict the interval between a substrate and an integrated circuit element when the element is electrically connected to the substrate with a solder bump. CONSTITUTION:An IC chip 1 having a solder bump 5 and a substrate having a conductor pattern 7 are restricted at a suitable interval by a spacer made of a conductor layer 10 and a resin layer 11. The material of the layer 10 is formed on the same material as the pattern 7 such as, copper, the layer 11 is formed of epoxy or polyurethane solder resist in a thickness of approx. 20mum. In this manner, the swelling at the center of the solder bump 5 can be suppressed by the operation of an interval control layer. Accordingly, the deformation produced due to the difference of the thermal expansion coefficient between the IC chip and the substrate can be readily absorbed, thereby reducing the improper connection. |
