| 摘要 |
A rotational moldable polyamide composition, a method of preparing the composition, and a method of rotational molding. The composition contains from about 0,001 percent to about 0,5 percent by weight of a copper compound, preferably cuprous iodide. Preferably, the composition contains from about 0,001 percent to about 0,3 percent by weight of potassium iodide. |
