发明名称 PROCESS FOR MANUFACTURING A FILLED CASING FOR A DISC SHAPE SEMI-CONDUCTOR BODY AND PRESENTING AT LEAST ONE PN JONCTION
摘要 <p>PCT No. PCT/CH79/00070 Sec. 371 Date Feb. 21, 1980 Sec. 102(e) Date Feb. 21, 1980 PCT Filed May 18, 1979 PCT Pub. No. WO80/00640 PCT Pub. Date Apr. 3, 1980.The invention concerns a method for the construction of a sealed disc cell housing for a disc shaped semiconductor body (1), which consists, essentially, of a hollow-cylindrical insulation housing (9) and two pressure contact bodies (4). The latter are provided with seal rings (12) comprising tubing sections of a plastic material which has been treated by electron irradiation and is expandable by heating. The contact bodies (4) are inserted into the insulation housing (9) and the seal ring (12) heated, whereby the wall thickness of the tubing sections (12) increases seal the gap between the pressure contact bodies (4) and the insulation housing (9).</p>
申请公布号 EP0015983(B1) 申请公布日期 1982.10.27
申请号 EP19790900496 申请日期 1980.04.08
申请人 BBC AKTIENGESELLSCHAFT BROWN, BOVERI & CIE. 发明人 EISELE, DIETER
分类号 H01L23/04;H01L21/50;H01L23/051;H01L23/10;H01L23/48;(IPC1-7):01L21/50;01L21/60;01L23/04;01L23/10 主分类号 H01L23/04
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