发明名称 RESIN COMPOSITION FOR EXTRUSION MOLDING
摘要 PURPOSE:To provide the titled composition suitable for use in a heat-sealing layer of wrapping material and having an excellent extrudablity, by melt-blending low-density polyethylene, ethylene/alpha-olefin copolymer and low-crystalinity ethylene/alpha-olefin copolymer. CONSTITUTION:The titled composition is prepared by melt-blending about 10- 70wt% polyethylene density 0.91-0.94g/cm<3>, obtained by radical polymerization, about 20-80wt% ethylene/alpha-olefin (3-8C) copolymer, density 0.91-0.95, and about 10-50wt% low-crystalinity or amorphous ethylene/alpha-olefin (3-4C) copolymer, density 0.85-0.90, and adjusting the composition to have melt index of 1- 15g/10min (190 deg.C) and melt tensile strength of 1.0-7.0g (190 deg.C).
申请公布号 JPS57174329(A) 申请公布日期 1982.10.27
申请号 JP19810060001 申请日期 1981.04.21
申请人 MITSUI PORIKEMIKARU KK 发明人 KATAGIRI MIKIO;HIROSHIGE KUNIE;SUMITA KATSUMI;HIRONAKA YOSHITAKA
分类号 C08L23/00;C08L7/00;C08L21/00;C08L23/04;C08L23/06;C08L23/08;C08L23/16;C08L101/00 主分类号 C08L23/00
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