首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
CHEMICAL COPPER PLATING SOLUTION
摘要
申请公布号
JPS57174445(A)
申请公布日期
1982.10.27
申请号
JP19810059212
申请日期
1981.04.21
申请人
TOKYO SHIBAURA DENKI KK
发明人
SASAKI OSAMU;TAKEDA KAZUHIRO;ITOSATO KUNIHIRO
分类号
C23C18/40
主分类号
C23C18/40
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Method and apparatus for enabling authorized and billable message transmission between multiple communications environments
Sheathed cable for underground mining
Connector plug
[COMBINATION OF BURN-IN SOCKET AND ADAPTER BORAD]
Gene for increased somatic recombination
Flare stack combustion method and apparatus
Process for forming toners from dry pigments
Liquid precursor refill system
Conjugates of galactose-binding lectins and clostridial neurotoxins as analgesics
Heat shock fusion-based vaccine system
Method for detecting and isolating t lymphocytes that recognize a defined antigen
Semiconductor manufacturing system and method for manufacturing a semiconductor device
Versatile processes for preparing and using novel composite particles in powder coating compositions
Sterilization apparatus, and method for sterilizing surfaces
Drive system for fluid flow device
Gear pump
Medicine-bag printing apparatus
Fluid dispensing system using an interface device attached to the top of a container for viscous fluids, paints, and the like
Tape producing apparatus
Slide assembly