| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip for evaluating characteristics that can cope with the design change of the size of a semiconductor chip. SOLUTION: On a wafer, unit chips each having a TEG for evaluation are formed in an array. The length and width of the evaluation chip is A times of a length and B times of a width (A and B are integers) of the unit chip. In performing the design change of the size of the semiconductor chip, the values of A and B are changed to correspond to the size after its design change. Thereby, the chip for evaluation having the same size as the semiconductor chip can be obtained. COPYRIGHT: (C)2009,JPO&INPIT |
