| 摘要 |
<p>A ceramic chip carrier having a copper lead frame (3) bonded directly to a ceramic substrate (1) has a common rim (13, 23) Connecting the tip portions (7) of the leads. The rim (13, 23) is raised above the substrate (1) and does not bond to the substrate (1) and is removed after bonding. In one embodiment the rim (13) is of reduced thickness to space it from the substrate (1) and a perforated ground pad (10) may be provided which is connected to the rim (13) by tabs (14). In another embodiment the rim (23) is provided with extended portions (15) which permit bending the rim (23) away from the substrate without altering the relative positions of the tip portions (7).</p> |
