| 发明名称 |
MOUNTING SEMI-CONDUCTOR ELEMENTS WITH INSULATING ENVELOPE |
| 摘要 |
<p>In a power semiconductor element, for mounting according to the method of pressure contact and silver coupel of the type known from the DE-PS 20 39806, a pressure contact body (21, 22) is provided with grooves (25, 26) and, arranged within said grooves, are sealed rings (23, 24) located onto the inner wall on the insulating envelope (29). The arrangement withstands important temperature variations.</p> |
| 申请公布号 |
EP0016768(B1) |
申请公布日期 |
1982.10.27 |
| 申请号 |
EP19790900486 |
申请日期 |
1980.01.29 |
| 申请人 |
BBC AKTIENGESELLSCHAFT BROWN, BOVERI & CIE. |
发明人 |
EISELE, DIETER;KMITTA, HUBERT |
| 分类号 |
H01L29/74;H01L23/04;H01L23/051;H01L23/10;H01L23/16;H01L23/48;(IPC1-7):01L23/04;01L21/60;01L23/10 |
主分类号 |
H01L29/74 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
